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Microthermoelectric cooler (MTEC) of the „Telecom“ series are made of ceramics Al2O3 (Alumina) or AlN (Aluminium nitride) of different thickness. Parameters and dimensions of the MTECs are given in the following tables.
| Al2O3 ceramics of 0,5mm thickness | AlN ceramics of 0,5mm thickness |
| Al2O3 ceramics of 0,32mm thickness | AlN ceramics of 0,25mm thickness |
MTEC Assembling:
1. Solder SnSb (Tmelt = 230°C) – ROHS Conform
2. Solder PbSn (Tmelt = 183°C)
3. Solder SnBi (Tmelt = 139°C) – ROHS Conform
Standard Options
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Description |
Notation |
Note |
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*Substrate material |
Alumina |
Al2O3 |
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*Max.operating temperature |
200°C |
T(200) |
ROHS Conform ROHS Conform |
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Resistance tolerance |
±10% |
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Height tolerance |
±0,05mm |
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Parallelism |
≤0,02mm |
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Flatness |
≤0,01mm |
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*Wires lenght |
as directed by the customer |
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*Ceramic plates of hot side and cold side |
Blank ceramic |
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Vacuum cleaning and annealing |
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VCA |
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